Intermetalic Copper Phase Characteristics and Links with the Gold Sphere in Alumina Cover Sheets
Abstract
The time period in which the intermetalic sheet cover is developed into the gold sphere in alumina is fully known being relatively not much literature regarding the morphology ant intermetalic phases growth in the copper sphere related to the core with metal alumina. The optimisation and development of thicker copper wiring related in the linkage process(bonding process) for each application needs a intermetalic cover linkage bonding and the growth of intermetalic Au-Al phase which takes place after isothermic eldering.
This study describes the problems and aspects associated with detemining of the covering area and of the layer and a few characteristics of intermetalic Cu-Al and Au-Al compounds are brought in evidence by the difference between the growth the Au-Al intermetalic phases and Cu-Al intermetalic phases.
Positive aspects and the gold enheritage of gold and copper in this spherical bonds in are shortly discussed.
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References
[2]. G. Harman, "Wire Bonding in Microelectronics Materials, Processes, Reliability and Yield", 2 ed., Electronic Packaging and Interconnection, ed. C.A. Harper. 1997: McGraw-Hill.
[3]. F.W. Wulff, C.D. Breach, D. Stephan, Saraswati and K.J. Dittmer, Characterization of Intermetallic Growth in Copper and Gold Ball Bonds on Aluminum Metallization, Proceedings of Electronics Packaging Technology Conference, 6th, Singapore, Dec. 8-10, 2004: 348-353, 2004.
[4]. ***, Semiconductor Packaging Module II.
[5]. James J. Wang and Bob Baird Power gold for 175 °C Tj-max.
[6]. ***, Semiconductor Packaging Assembly Technology 2000 National Semiconductor Corporation.
[7]. Ying Zheng Study Of Copper Applications And Effects of Copper Oxidation In Microelectronic Package In Partial Fulfillment of MatE 234. 2003.
[8]. Kulicke & Soffa Complete Connection DHF &iCu Copper Bonding Wire for Power Devices and High-End ICs.
