Copper Plating Corrosion Study in Certain Environments
Abstract
Copper plating was performed on nickel substrate by means of the potentiostatic electrodeposition method from a sulphate electrolyte solution. The copper coatings morphology was studied by means of the optical and electronic scanning microscopy techniques. The uniform electrodeposited films have a thickness of about 15 µm measured in cross-section. The corrosion behaviours of nickel substrate and copper films in different corrosive environments were studied. The corrosion study was performed by means of the linear polarisation method in four acid environments: 0.5 M H2SO4, HCl, HNO3 and glacial CH3COOH. From the recorded Tafel curves it was possible to obtain some information about the corrosion rate and the polarization resistance. In order to confirm these results, the gravimetric parameter was calculated by means of the “mass loss” method. By means of the X-ray diffraction analysis, the crystallographic structure of the specimens before and after corrosion was revealed. By means of the spectrophotometer device, the optical properties of the specimens were analysed.
Downloads
References
[2]. A. Radisic, J.G. Long, P.M. Hoffmann, P.C. Searson - J. Electrochem. Soc. 148 (1), (2001), C41.
[3]. G. Oskam, P.M. Vereecken, P.C. Searson - J. Electrochem. Soc. 146 (4), (1999), 1436.
[4]. D. Grujicic, B. Pesic - Electrodeposition of copper: the nucleation mechanisms, Electrochim. Acta 47, (2002), 2901-2912.
[5]. Aurbach D, Markovisky B et al - J. Power Sources 491:499, (2007).
[6]. Xu J, Thomas HR et al - J. Power Sources 512-527 (2008).
[7]. Searson PC, Ross FM et al - Surf. Sci. 1817-1826 (2006).
[8]. Zangari G, Arrington D et al - Electrochim. Acta 2644-2649 (2008).
[9]. Pasquale MA, Gassa LM et al - Electrochim. Acta 5891-5904 (2008).
[10]. Gabrielli C, Devos O et al - J. Electroanal. Chem. 95-102 (2007).
[11]. Nikolitic ND, Brankovic G et al - J. Electroanal. Chem. 13-21 (2008).
[12]. V. G. Celante, Ć M. K. Pietre, Ć M. B. J. G. Freitas - Electrochemical and structural characterization of copper recycled from anodes of spent Li-ion batteries, J. Appl. Electrochem. (2010) 40:23–28 DOI 10.1007/s10800-009-9959-2.
[13]. D. Grujicic, B. Pesic - Electrodeposition of copper: the nucleation mechanisms, Department of Materials, Mining and Metallurgical Engineering and Geology, University of Idaho, McClure Hall, Moscow, ID 83844-3024, USA.
[14]. A. Vicenzo, P.L. Cavallotti - Copper electrodeposition from a pH 3 sulfate electrolyte, J. Appl. Electrochem. 32: 743–753, (2002).
[15]. A.M. Cantaragiu - Studii si cercetari privind obtinerea si caracterizarea unor acoperiri nanostructurate biocompatibile, PhD Thesis, (2011).
[16]. D. Popovici, E. Trimbitasu, O. Pantea, D. Bombos, L. Antonescu - Determinarea eficientei inhibitorului de coroziune Aticamina OTM 2 (The efficiency study of OTM2 Aticamina corrosion inhibitor), Buletinul Universităţii Petrol-Gaze din Ploieşti (Bulletin of the Petroleum-Gas University of Ploiesti), LIV, 4, 189-196, (2002).
[17]. P. Hagioglu, C. Gheorghies, A.M. Cantaragiu, S. Moisa - The Accelerated Corrosion Behaviour in Saline Environments of Some Samples Made of Tombac, Copper and Aluminium, J. Sci. Arts, Year 20, 1(12), pp. 153-160, (2010), ISSN: 1844-9581, eISSN: 2068-3049.
[18]. *** Joint Committee on Powder Diffraction Standards (1991) Diffraction Data File, No.45-0594, JCPDS international center for diffraction data, Pennsylvania.
[19]. *** Joint Committee on Powder Diffraction Standards (1991) Diffraction Data File, No.5-661, JCPDS international center for diffraction data, Pennsylvania.
[20]. P. Hagioglu, C. Gheorghies, A.M. Cantaragiu, R. Boiciuc, N. Tigau - Corrosion Behaviour of Tombac Used in Cult Objects Manufacturing, The Annals of “Dunarea de Jos” University of Galati, Fascicle IX, Metallurgy and Materials Sciences, 2, (2009), ISSN 453-083X.
